Success story: Trymax receives multi-system orders from a leading Chinese Compound Semiconductor company

NIJMEGEN, THE NETHERLANDS – October 17, 2018. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 Series from a Chinese foundry. This news confirms the expansion of Trymax’s footprint in the region and reinforce the company’s leadership in compound semiconductor equipment. Shipping of the first systems will be in Q4 2018 and continue during Q1 2019.

Trymax’s NEO 2000 Series was selected by the customer to perform photoresist ashing and descum on SiC and LiTaO3 substrates. Main end applications will be in the field of RF and power electronics that are both facing significant growth driven by the IoT, 5G, and automotive. According to Yole Développement (Yole), the market research and strategy consulting company, the SiC market is expected to reach more than US$1.5 billion by 2023 showing an impressive CAGR of 31% over the 2017-2023 period (1). In parallel, Yole’s forecast for the total SAW filters market will be almost US$ 4 billion in 2023 for mobile applications (2).

The NEO 2000 Series is a reliable high throughput and low cost of ownership dual chamber system. It will be configured with both high and low temperature plasma chambers and process wafers from 4 up to 8’’. These multi-system orders come in addition of previous multi-system orders received by Trymax from the same customer a few years ago. “We are thankful by this strong vote of confidence in our state-of-the-art solutions” stated Ludo Vandenberk, Executive Vice President of Trymax. “Partnership and best-in-class customer support has been key values of Trymax since the beginning of the company’s operations. Winning this additional business confirms our strategy is right and we look forward to supporting our customer growing its business”.

(1) Source: Power SiC 2018: Materials, Devices and Applications report, Yole Développement, 2018
(2) Source: 5G’s Impact on RF Front-End Module and Connectivity for Cell Phones report, Yole Développement, 2018

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